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Design and Manufacture of Microdevices

Faculty of EngineeringDepartment of Mechanical Engineering
Credits3
·
Semester offeredSemester 1 (Fall), Semester 2 (Winter)
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Last updated3 months ago

Description

Introduction to microelectromechanical systems (MEMS). Micromachining techniques (thin-film deposition; lithography; etching; bonding). Microscale mechanical behaviour (deformation and fracture; residual stresses; adhesion; experimental techniques). Materials- and process-selection. Process integration. Design of microdevice components to meet specified performance and reliability targets using realistic manufacturing processes.

Course outline
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MECH553 has possible credit equivalents including MECH3710 at The Hong Kong University of Science and Technology.

CourseUniversityQwest Score
MECH3710
Manufacturing Processes and Systems
The Hong Kong University of Science and Technology74
ME3263
Design For Manufacturing And Assembly
National University of Singapore74
MECH4720
Introduction to Precision Engineering
The Hong Kong University of Science and Technology73
MECH4430
Materials Characterization
The Hong Kong University of Science and Technology73
MLE4228
Materials For Robotic Sensing And Actuation
National University of Singapore73